The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Produkteigenschaften
- Artikelnummer: 9780442015053
- Medium: Buch
- ISBN: 978-0-442-01505-3
- Verlag: Springer US
- Erscheinungstermin: 31.01.1994
- Sprache(n): Englisch
- Auflage: 1994
- Produktform: Gebunden, HC runder Rücken kaschiert
- Gewicht: 1780 g
- Seiten: 418
- Format (B x H x T): 157 x 235 x 28 mm
- Ausgabetyp: Kein, Unbekannt